ADLink Rugged Embedded Computer ...
Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.
Features
To contact Ti2 Pty Ltd about ADLink Rugged Embedded Computer Finned-Convection System HPERC use Get a quote.
Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.
Features
To contact Ti2 Pty Ltd about ADLink Rugged Embedded Computer Finned-Convection System HPERC use Get a quote.
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